Technical Parameters
Part Number：RM02C00919
Layer count: 2
Board thickness：0.10mm
Dimension：78*59.64mm
Raw material：double sided, RD copper without AD
Copper thickness on the board surface：25um
Copper thickness in the hole barrel：12um
Min.line width/space：0.12mm
Minimum hole diameter：0.2mm
Surface finishing：immersion gold≥1u"
Application：POS
Technology Feature
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We reserves 200,000Sqft capacity in our FPC operation
for high volume demand from consumer electronics market.
for high volume demand from consumer electronics market.
Min.board thickness: 0.1mm.
We understand customer's concern and specially process FPC for great uniformity of solder mask.
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