Technical Parameters
Part Number:GHM08C03061A0
Layer count: 3 stage 8 layer
Board thickness:2.0mm
Dimension:261*180.98mm
Raw material:FR4 EM825
Copper thickness on the board surface:≥35um
Copper thickness in the hole barrel:20um
Min.line width/space:0.075mm
Minimum hole diameter:0.1mm
Surface finishing:immersion gold≥2u"
Pitch: P0.9
Application:LED
DVCP lines to prevent bubbling inside the filled blind via.
Our leading edge technology of 3+8+3 stack via
powers up the functional performance of your products.
min. line width/space: 0.075mm,
drilling depth tolerance: ±0.15mm.
We guarantee excellent colour uniformity of the solder mask with selected material
and advanced automatic screen printing machine.
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