Technical Parameters
Part Number：GHM08C03061A0
Layer count: 3 stage 8 layer
Board thickness：2.0mm
Dimension：261*180.98mm
Raw material：FR4 EM825
Copper thickness on the board surface：≥35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.075mm
Minimum hole diameter：0.1mm
Surface finishing：immersion gold≥2u"
Pitch: P0.9
Application：LED
Technology Feature
Our customized solution can meet tight dimensional spec of ±0.05mm
We process copper filling for blind via with advanced
DVCP lines to prevent bubbling inside the filled blind via.
DVCP lines to prevent bubbling inside the filled blind via.
Our leading edge technology of 3+8+3 stack via
powers up the functional performance of your products.
min. line width/space: 0.075mm,
drilling depth tolerance: ±0.15mm.
We guarantee excellent colour uniformity of the solder mask with selected material
and advanced automatic screen printing machine.
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