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Mobile Phone

New generation of smart phones are ultra-slim designed, this brings significant changes in PCB manufacturing process. With years of manufacturing for main board, connecting board, camera, fingerprint identification for smart phone, we have been delivering high quality performance PCB including HDI, PTH, flex and rigid-flex boards for many well-recognized customers.
Applications
TWS
Layer Count
6L HDI with 1 stage
Material
FR4+FCCL
Board thk.
1.0mm
Application
TWS
Wireless Charging
Layer Count
2L
Material
FCCL
Board thk.
0.15mm
Application
Wireless Charging
Side Fingerprint
Layer Count
2L
Material
FCCL
Board thk.
0.1mm
Application
Side Fingerprint
Motherboard
Layer Count
10L HDI with 3 stage
Material
FR4
Board thk.
0.72mm
Application
Motherboard
LCM
Layer Count
2L
Material
FCCL
Board thk.
0.10mm
Application
LCM
Battery
Layer Count
4L
Material
FR4+FCCL
Board thk.
1.80mm
Application
Battery
Ultrasonic Fingerprint
Layer Count
2L
Material
FR4+FCCL
Board thk.
0.12mm
Application
Ultrasonic Fingerprint
CCM
Layer Count
4L(1+2+1)
Material
FR4+FCCL
Board thk.
0.4mm
Application
CCM
Cooperative Clients
Lighting
Layer Count
2L Thermoelectric separation