| Iterm | 2024 | 2025 | 2026 | |
| RPCB | Layers | 48L | 48L | 48L |
| Finish Size | 1320mm×600mm | 1320mm×600mm | 1320mm×600mm | |
| Aspect Ratio(Finish Hole) | 12:1 | 12:1 | 12:1 | |
| Max. Copper Thickness | 15 OZ | 15 OZ | 15 OZ | |
| HDI | Structure | 4+N+4 | Any Layer | Any Layer |
| Board thk.(2+8+2) | 0.80mm | 0.6mm | 0.6mm | |
| Line Width/Space | 40um/40um | 40um/40um | 40um/40um | |
| Aspect Ratio(Blind Hole) | 1:1 | 1:1 | 1:1 | |
| FPC | Layers | 8L | 10L | 10L |
| Line Width/Space | 38um/38um | 38um/38um | 38um/38um | |
| Min. hole size | 0.10mm | 0.10mm | 0.10mm | |
| Impedance Tolerance | ±7% | ±5% | ±5% | |
| Rigid &Flex | Layers | 10L | 12L | 12L |
| HDI structure | HDI(2 stage) | HDI(3 stage) | HDI(3 stage) | |
MCPCB （IMS-CU/Al/Fe） | Minimum buried copper inlay dimension | 5mm*5mm | 5mm*5mm | 5mm*5mm |
Board thk. | 1.0mm-5.0mm | 1.0mm-5.0mm | 1.0mm-5.0mm | |
| Bendable | yes | yes | yes | |
| Ceramic inlay | yes | yes | yes | |
| Thermoelectric separation | yes | yes | yes | |
| Thermoelectric separation flatness | +/- 0.03mm | +/- 0.03mm | +/- 0.03mm | |
| Surface finish | ENEPIG, HASL, Lead-free HASL, OSP, ENIG, Image, Imm.Sn, Electrolytic Ni/Au, Electrolytic Tin, Electrolytic Silver | |||
